SR700

•Intel® Haswell BGA i7-4700EQ + Intel QM87 PCH

(4 cores x 2.4GHz, 47W)

•DDR3 XR-DIMM up to 8GB memory

System

CPU	Intel® Core™ i7 Haswell , BGA type Intel® Core i7-4700EQ (4C x 2.4/1.7 GHz), 6M Cache (47W)
Chipset	Intel® QM87 Chipset (Intel® DH82QM87 PCH)
Memory Type	1 x DDR3 1600 XR-DIMM up to 8 GB with ECC
Expansion Slot	2 x mPCIe (1 x colay with mSATA) for GEN2
Operating Temp.	-40°C ~ 70°C

Front I/O

Power Button

1 for water proof

Power Input

1 for water proof

Ethernet

Intel® I210IT & i217LM GbE

COM

1 x RS232 (for 1 x M12 female connector)

Serial Signals

RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-

Display

1 x VGA (for 1 x M12 female connector)

USB

2 x USB 2.0 (for 1 x M12 female connector)

OS support list

Windows	TBD
Linux	Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04

Mechanical & Environmental

Power Requirement	9V to 36V DC-in, AT/ATX mode with power delay on/off
Dimension	350 x 230 x 76 mm
Operating Temp.	-40°C ~ 70°C(ambient with air flow)
Storage Temp.	-40 to 85°C
Relative Humidity	5% to 95%, non-condensing

TEST STANDARD

MIL-STD-810G Test

Method 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)

EMC

CE and FCC compliance

Green Product

RoHS, WEEE compliance