SR700

•Intel® Haswell BGA i7-4700EQ + Intel QM87 PCH

(4 cores x 2.4GHz, 47W)

•DDR3 XR-DIMM up to 8GB memory

 

System

CPU

Intel® Core™ i7 Haswell , BGA type

Intel® Core i7-4700EQ (4C x 2.4/1.7 GHz), 6M Cache (47W)

Chipset Intel® QM87 Chipset (Intel® DH82QM87 PCH)
Memory Type 1 x DDR3 1600 XR-DIMM up to 8 GB with ECC
Expansion Slot 2 x mPCIe (1 x colay with mSATA) for GEN2
Operating Temp. -40°C ~ 70°C

 

 

Front I/O

Power Button 1 for water proof
Power Input 1 for water proof
Ethernet Intel® I210IT & i217LM GbE
COM
1 x RS232 (for 1 x M12 female connector)
Serial Signals
RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-
Display 1 x VGA (for 1 x M12 female connector)
USB 2 x USB 2.0 (for 1 x M12 female connector)

 


OS support list

Windows TBD
Linux Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04

 

 

Mechanical & Environmental

Power Requirement 9V to 36V DC-in, AT/ATX mode with power delay on/off
Dimension 350 x 230 x 76 mm
Operating Temp. -40°C ~ 70°C(ambient with air flow)
Storage Temp. -40 to 85°C
Relative Humidity 5% to 95%, non-condensing

 


TEST STANDARD

 

 

MIL-STD-810G Test

Method 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)

EMC

CE and FCC compliance

Green Product

RoHS, WEEE compliance

 

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