SR200

•Intel® Haswell BGA i7-4700EQ + Intel QM87 PCH

(4 cores x 2.4GHz, 47W)

•DDR3 XR-DIMM up to 8GB memory

 

System

CPU

Intel® Core™ i7 Haswell , BGA type

Intel® Core i7-4700EQ (4C x 2.4/1.7 GHz), 6M Cache (47W)

Chipset Intel® QM87 Chipset (Intel® DH82QM87 PCH)
Memory Type 1 x DDR3 1600 XR-DIMM up to 8 GB with ECC
Expansion Slot 2 x mPCIe (1 x colay with mSATA) for GEN2
Storage Device Onboard uSSD SATAIII up to 64 GB
Ethernet Chipset Intel® I210IT & i217LM GbE
Operating Temp. -40°C ~ 70°C

 

 

Front I/O

Power Button Yes
Power LED Yes
HDD LED Yes
LAN LED Yes
USB 2 x USB 3.0
DisplayPort 4 support by NVDIA
Power 1 x Terminal Block

 


Rear I/O

Ethernet 2 x RJ45 ports
Audio Mic-in, Line-out
COM
1x RS-232/422/485 ports, Jumper-selectable (DB9 male)
Serial Signals
RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-
RS422: TX-, RX+, TX+, RX-, GND
RS485- 4W: TxD+, TxD-, RxD+, RxD-, GND
RS485- 2W: DATA-, DATA+, GND
USB 2 x USB 3.0
DisplayPort 2 support by Intel QM87 chipset

 


Display

Display Resolution 4 x DP Up to 3840 x 2160
GPU NVIDIA GT730M
(embedded on PCIe/104 form factor)

 


OS support list

Windows TBD
Linux Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04

 

 

Mechanical & Environmental

Power Requirement 9V to 36V DC-in, AT/ATX mode with power delay on/off
Dimension 308 x 149 x 76 mm
Operating Temp. -40°C ~ 70°C(ambient with air flow)
Storage Temp. -40 to 85°C
Relative Humidity 5% to 95%, non-condensing

 


TEST STANDARD

 

 

MIL-STD-810G Test

Method 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)

EMC

CE and FCC compliance

Green Product

RoHS, WEEE compliance

 

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