SR100

•4th Generation Intel® Core™ i7 Haswell processors (BGA)

•XR-DIMM up to 8 GB RAM

•Onboard uSSD SATAIII up to 64 GB

System

CPU	Intel® Core™ i7 Haswell , BGA type Intel® Core i7-4700EQ (4C x 2.4/1.7 GHz), 6M Cache (47W)
Chipset	Intel® QM87 Chipset (Intel® DH82QM87 PCH)
Memory Type	1 x DDR3 1600 XR-DIMM up to 8 GB with ECC
Expansion Slot	2 x mPCIe (1 x colay with mSATA) for GEN2
Storage Device	1 x SATA III 6 Gb/s, 2.5" SSD/HDD
Ethernet Chipset	Intel® I210IT & i217LM GbE
Operating Temp.	-40°C ~ 70°C

Front I/O

Power Button	Yes
Power LED	Yes
HDD LED	Yes
LAN LED	Yes
Reset Button	Yes
USB	2 x USB 3.0
Power	1 x Terminal Block

Rear I/O

DisplayPort

2 x 20-pin DP connector (female)

DVI-I

1 x 29-pin DVI-D connector (female)

Ethernet

2 x RJ45 ports

Audio

Mic-in, Line-out

COM

1x RS-232/422/485 ports, Jumper-selectable (DB9 male)

Serial Signals

RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-

RS422: TX-, RX+, TX+, RX-, GND

RS485- 4W: TxD+, TxD-, RxD+, RxD-, GND

RS485- 2W: DATA-, DATA+, GND

USB

2 x USB 3.0

Audio

1 x MIC, 1 x Line out

Display

Display Interface	DVI-I interface x 1: 29-pin DVI-I connectors(female); resolution up to 1920 x 1200@60 Hz; Display port interface x 2: 20-pin display port connectors (female); resolution up to 3840 x 2160@60 Hz
Graphics Controller	Onboard Intel® HD 4600 graphics

OS support list

Windows	TBD
Linux	Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04

Mechanical & Environmental

Power Requirement	9V to 36V DC-in, AT/ATX mode with power delay on/off
Dimension	250 x 149 x 76 mm
Operating Temp.	-40°C ~ 70°C(ambient with air flow)
Storage Temp.	-40 to 85°C
Relative Humidity	5% to 95%, non-condensing

TEST STANDARD

MIL-STD-810G Test

Method 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)

EMC

CE and FCC compliance

Green Product

RoHS, WEEE compliance