SR100

•4th Generation Intel® Core™ i7 Haswell processors (BGA)

•XR-DIMM up to 8 GB RAM

•Onboard uSSD SATAIII up to 64 GB

 

System

CPU

Intel® Core™ i7 Haswell , BGA type

Intel® Core i7-4700EQ (4C x 2.4/1.7 GHz), 6M Cache (47W)

Chipset Intel® QM87 Chipset (Intel® DH82QM87 PCH)
Memory Type 1 x DDR3 1600 XR-DIMM up to 8 GB with ECC
Expansion Slot 2 x mPCIe (1 x colay with mSATA) for GEN2
Storage Device 1 x SATA III 6 Gb/s, 2.5" SSD/HDD
Ethernet Chipset Intel® I210IT & i217LM GbE
Operating Temp. -40°C ~ 70°C

 

 

Front I/O

Power Button Yes
Power LED Yes
HDD LED Yes
LAN LED Yes
Reset Button Yes
USB 2 x USB 3.0
Power 1 x Terminal Block

 


Rear I/O

DisplayPort 2 x 20-pin DP connector (female)
DVI-I 1 x 29-pin DVI-D connector (female)
Ethernet 2 x RJ45 ports
Audio Mic-in, Line-out
COM
1x RS-232/422/485 ports, Jumper-selectable (DB9 male)
Serial Signals
RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-
RS422: TX-, RX+, TX+, RX-, GND
RS485- 4W: TxD+, TxD-, RxD+, RxD-, GND
RS485- 2W: DATA-, DATA+, GND
USB 2 x USB 3.0
Audio 1 x MIC, 1 x Line out

 


Display

Display Interface DVI-I interface x 1: 29-pin DVI-I connectors(female); resolution up to 1920 x 1200@60 Hz; Display port interface x 2: 20-pin display port connectors (female); resolution up to 3840 x 2160@60 Hz
Graphics Controller Onboard Intel® HD 4600 graphics

 


OS support list

Windows TBD
Linux Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04

 

 

Mechanical & Environmental

Power Requirement 9V to 36V DC-in, AT/ATX mode with power delay on/off
Dimension 250 x 149 x 76 mm
Operating Temp. -40°C ~ 70°C(ambient with air flow)
Storage Temp. -40 to 85°C
Relative Humidity 5% to 95%, non-condensing

 


TEST STANDARD

 

 

MIL-STD-810G Test

Method 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)

EMC

CE and FCC compliance

Green Product

RoHS, WEEE compliance

 

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